LOCTITE? ABLESTIK 84-1LMISR4 provides the following product：
技術：環氧
外觀：銀
固化：熱固化
pH ：6.0
產品好處●導電●箱烤箱治療●用量極小
應用：芯片粘接
84-1LMISR4導電芯片粘接粘合劑已制定用于高通量，自動化模具附加設備。84-1LMISR4粘合劑的流變學允許最小的粘合劑分配和模具停留時間，沒有尾礦或串線問題。獨特的粘接特性組合使這種材料成為半導體工業中應用最廣泛的模具附著材料之一。
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm)
5.6
Viscosity, Brookfield CP51, 25 °C, mPa·s (cP):
Speed 5 rpm
8,000
Work Life @ 25°C, Physical worklife by % filler, hours
18
Shelf Life @ -40°C (from date of manufacture), days
365
?
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 175°C
?
Alternate Cure Schedule
?
3 to 5 minute ramp to 175°C + 1 hour @ 175°C
?
Glass Transition Temperature, TMA penetration, °C
120
Coefficient of Thermal Expansion, TMA expansion:
Below Tg, ppm/°C
40
Above Tg, ppm/°C
150
Thermal Conductivity @ 121oC, C-matic Conductance
Tester, W/(m-K)
2.5
Tensile Modulus, DMTA :
@ -65°C
N/mm2 4,400
(psi) (640,000)
@ 25 °C
N/mm2 3,900
(psi) (570,000)
@ 150 °C
N/mm2 2,000
(psi) (290,000)
@ 250 °C
N/mm2 300
(psi) (44,000)
